INCIDENT ANALYSIS AND FAB CONSULTATION
Helios offers cutting-edge expertise to assist semiconductor fabs in resolving tool failures and operational issues through root cause analysis and incident reporting. Whether it’s a specific tool malfunction or a broader operational challenge, Helios specializes in investigating every detail of your setup, delivering actionable solutions that not only address current issues but also enhance fab performance and consistency over the long term.
Expert Incident Investigation: Our team meticulously examines every aspect of your operations to identify the root cause of failures or inefficiencies.
Collaborative Root Cause Analysis: We work with your team to develop a detailed analysis report of incidents in your company’s standardized root cause analysis format, complete with mitigation strategies and recovery recommendations.
Fab Setup Optimization: Beyond fixing issues, we provide tailored solutions to help improve fab performance, consistency, and output.
A CASE STUDY
Take, for example, our recent work with a semiconductor fab that encountered a ruptured reaction chamber. Our investigation identified not one, but two interlinked causes:
- Bellows were found to be leaking due to lack of timely maintenance.
- A fire in the exhaust plenum that caused the scrubber to rupture, creating an ignition source and resulting in overpressure in the ATM chamber.
Helios didn’t stop at identifying the issues. We delivered a detailed root cause analysis report with recommendations for mitigation and recovery. Not only did we enable the client to repair their damaged tools, but we also overhauled their fab setup to improve output consistency and performance.
With Helios, your fab gets more than solutions – it gains a roadmap for operational excellence.